Intel Corporation Physical Design Engineer interview questions

Telephonic:Process and Temp variation for delays,Voltage and TEmperature effect on Metal LAyer,Synthesis flow:Inputs.How do u do floorplanning.?Power types and methods to control,DRC,challenges during placementa nd congestion Onsite; First ROund:Whole RTL to Netlist flow in detail,Timing correlation,miller effect,virtual routes),Sceond ROund: How do u solve DC and ICC correlation:DC putting lots of buffers-Reasons,How will u solve clock transition if sizing is not posibble(Explain MErging), 3rd Round : TECH DRC Questions :One problem was given :write a script to replace with right optimized via in power plan .4th Round :STA problems,3 equations -waveforms;derate effects,positive and negative edge flops at capturing end.5th ROund: Custom Bus routing (How to do manually for timing critical path),Script to find occurences of via in design by reference name and reduce runtime by not using get_cells twice.