The interview process is very straightforward, it is a 3 round process. Round 1: Icebreakers, then technical SV/UVM concepts, general digital concepts, about the previous job, and projects in that job. Round 2: Protocol Specific round, if interviewing for PCIe team, then technical round based on PCIe 3/4/5 specification, you are given the option to choose the protocol that you are good in or have spent a lot of time and you are confident that you can answer any in-depth corner case from the specification. Round 3: In my case, it was based on SV and UVM in-depth detailed concepts, majorly on coverage and constraints. Might ask you to code as well.

It was my campus placement of four rounds: 1. Pen Paper Test: 24 questions, 8 questions per section 2. Interview Round 1: Interview was based on the test taken by the company. The question which I couldn't answer was asked in the first 1:1 round. Interviewer guided me to achieve the solutions to check my thinking abilities 3. Interview Round 2: Questions which I answered correctly were discussed with solutions in details 4. HR interview: Same old HR questions. Tell me about yourself, How long do you plan to stay in the company, why Mentor.