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Associate Manufacturing Engineer Interview Questions

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9,540 associate manufacturing engineer interview questions shared by candidates

Difference between OFAT and fractional factorial DOE process( situation based), when to use which method, was asked to explain a DOE I conducted in detail and my thought process, which has more bias repetition or replication, example of response bias in a study I did, example of correlation study I did, how do I validate a DOE result( explained with ANOVA, regression model coefficient and R2, R2(adj) diff , VIF), how to conduct gage R&R, ndc in gage R&R, ndc of 1 meaning, if ndc < 5 is my measurement system bad, what does a ndc of < 5 mean for sample size, what is Cp/Cpk, when to use Cpm, asked to choose a process to deep dive based on Cp/Cpk values, when to use Pp/Ppk vs Cp/Cpk, can Cp be (-) ve, why not, experience with reliability testing, experience with surface finish, how to measure quantify surface roughness, cosmetic characteristics experience with a part, when to use t test, Chi square test questions, questions on datum selection, usage of positional/ profile tolerances, what is LMC, MMC modifier, calculating boundary conditions for hole and shaft mating, usage of I-MR chart, when to use X bar and X bar S chart, how to segregate data from a process to root cause common cause vs assignable cause. From projects- Asked about a machine availability improvement project, a project where I improved cycle time for a machine, a tolerance stack up project to come up with spec limits for a process, a DOE project- explain the process, what parameters I took, why, how I decided the parameter values, every nitty gritty, a vision project using a 3d profilometer - how I optimized program, what defects I was looking to catch, an X-Ray algorithm improvement project- asked to explain failure mode, issue with algorithm, how I changed spec, what was the impact on yield, how did I communicate idea to design team, question on part traceability from a project, experience with CMM/ stylus probes, experience with Helium leak test, questions on electrolyte filling process development for battery cells. Since I had experience with data engineering asked a ton of questions on how I set up a parameter, how I categorize as optional/ non optional, how I add constraints for NCs, they were curious on how I made SQL scripts for our process techs for root causing, asked about experience with Tableau dashboards.
avatar

Manufacturing Quality Engineer

Interviewed at Apple

4.1★
Sep 4, 2022

Difference between OFAT and fractional factorial DOE process( situation based), when to use which method, was asked to explain a DOE I conducted in detail and my thought process, which has more bias repetition or replication, example of response bias in a study I did, example of correlation study I did, how do I validate a DOE result( explained with ANOVA, regression model coefficient and R2, R2(adj) diff , VIF), how to conduct gage R&R, ndc in gage R&R, ndc of 1 meaning, if ndc < 5 is my measurement system bad, what does a ndc of < 5 mean for sample size, what is Cp/Cpk, when to use Cpm, asked to choose a process to deep dive based on Cp/Cpk values, when to use Pp/Ppk vs Cp/Cpk, can Cp be (-) ve, why not, experience with reliability testing, experience with surface finish, how to measure quantify surface roughness, cosmetic characteristics experience with a part, when to use t test, Chi square test questions, questions on datum selection, usage of positional/ profile tolerances, what is LMC, MMC modifier, calculating boundary conditions for hole and shaft mating, usage of I-MR chart, when to use X bar and X bar S chart, how to segregate data from a process to root cause common cause vs assignable cause. From projects- Asked about a machine availability improvement project, a project where I improved cycle time for a machine, a tolerance stack up project to come up with spec limits for a process, a DOE project- explain the process, what parameters I took, why, how I decided the parameter values, every nitty gritty, a vision project using a 3d profilometer - how I optimized program, what defects I was looking to catch, an X-Ray algorithm improvement project- asked to explain failure mode, issue with algorithm, how I changed spec, what was the impact on yield, how did I communicate idea to design team, question on part traceability from a project, experience with CMM/ stylus probes, experience with Helium leak test, questions on electrolyte filling process development for battery cells. Since I had experience with data engineering asked a ton of questions on how I set up a parameter, how I categorize as optional/ non optional, how I add constraints for NCs, they were curious on how I made SQL scripts for our process techs for root causing, asked about experience with Tableau dashboards.

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