Thermal Engineer Interview Questions

363 thermal engineer interview questions shared by candidates

Round 1 - Fins, Lumped system heat transfer, How would fan curve look when fans are arranged in series and in parallel?, Why is there a bottle neck in thermal conductivity of the adhesive used between a chip and heat dissipation device? Round 2 - Explain what CFD is for a high school student, Stable and Consistent solutions, errors and residue, internal and external flows, mesh size and error , types of error.
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Thermal Engineer

Interviewed at Intel Corporation

3.9
Jan 16, 2019

Round 1 - Fins, Lumped system heat transfer, How would fan curve look when fans are arranged in series and in parallel?, Why is there a bottle neck in thermal conductivity of the adhesive used between a chip and heat dissipation device? Round 2 - Explain what CFD is for a high school student, Stable and Consistent solutions, errors and residue, internal and external flows, mesh size and error , types of error.

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