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As a company dedicated to acting with purpose for a better world, we’re proud to share our 2023 Environmental, Social, and Governance (ESG) report. Explore more.
High-bandwidth memory (HBM) promises new levels of performance and efficiency, shaping the future of high-performance computing. Discover how our advanced packaging technology will unlock new possibilities in AI via TechArena.
With 20+ years at Lam, Keren Kanarik, our technical managing director, will join SEMI’s Industry Strategy Symposium (ISS) planning committee. Her thought leadership propelled us to the forefront of the industry, supported by her prominent publications, peer-reviewed papers, and more. Read about Keren’s journey to success.
To create the complex circuit patterns of modern-day silicon chips, wafers undergo a process called etching. Learn more about the process and explore the products we offer for etch systems.
The Lam Capital Competition brought dozens of startups from around the world to our Fremont headquarters. Centered on the theme "Enabling Future Semiconductors," the competition provided a platform for startups to showcase how their innovations revolutionize the semiconductor ecosystem.
As High Bandwidth Memory (HBM) stacks become widely adopted to meet #AI demands, through-silicon vias (TSVs) will become even more critical to scale. Learn why the creation of precise TSV structures is essential and how Lam is helping chipmakers address scaling challenges from Aaron Fellis, via 3D InCites.
By leveraging virtual fabrication, we conducted 1500+ virtual experiments to investigate whether deposition/etch cycling can improve line edge roughness (LER) in chip manufacturing. Learn how this process could be a game changer for advanced logic and memory devices of the future.
We bring together best-in-class researchers, equipment, and solutions to drive advanced packaging forward and ensure commercial success. Explore our progress in developing 3D semi structures and how it’ll reshape the next generation of chip manufacturing.
A recent report published by SEMI and Nasdaq states ensuring climate resilience of the value chain is a business imperative for semiconductor companies. Read about the importance of climate resilient strategies, as well as how we built an ESG governance structure to meet our climate-related goals.
In honor of #EarthMonth and beyond, Lam integrates sustainability into all our existing systems. From how we source materials to designing energy-saving technologies, we set science-based targets to decrease emissions and combat climate change. Read more.
