Intel Corporation Packaging Engineer interview questions

How do the transmission lines work? what is cross talk, to mitigate the cross talk what do we need to do? How is the current flow from top to bottom through via? Conductor properties? Why do we need a package? How it will impact the product yield or longevity? What is EMI AND ISI how can we reduce it? what are the different types of packages available and why are we moving from one to another? It just connects the dots from one question to another.

Technical questions and behavioral type questions